TX ON/OFF IN_L+ IN_L- IN_R+ IN_R- OUT1_L- OUT1_L+ OUT1_R- OUT1_R+ OUT2_L- OUT2_L+ OUT2_R- OUT2_R+ OUT3_L- OUT3_L+ OUT3_R- OUT3_R+ OUT4_L- OUT4_L+ OUT4_R- OUT4_R+ MAX232 RS232 TX RX GND GND RS422 TX- TX+ RX+ RX- TTL232 RX TX WIFI_GP SPK STATUS OUT SPK4 SPK3 SPK2 SPK1 STAT_1 STAT_2 STAT_3 STAT_4 STATUS OUT SWITCHES INPUTS MISC 1 MISC 2 SPK4 SPK4 SPK3 SPK1 SPK2 CAPACITOR chip >NAME >VALUE CAPACITOR chip >NAME >VALUE Panasonic Aluminium Electrolytic Capacitor VS-Serie Package E >NAME >VALUE Multilayer SMD >VALUE >NAME CHIPLED Source: http://www.osram.convergy.de/ ... LG_R971.pdf >NAME >VALUE RESISTOR chip >NAME >VALUE >NAME >VALUE SMA CASE 403D-02 Source: http://www.onsemi.com/pub_link/Collateral/MBRA340T3-D.PDF >NAME <h3>SparkFun Connectors</h3> This library contains electrically-functional connectors. We've spent an enormous amount of time creating and checking these footprints and parts, but it is the end user's responsibility to ensure correctness and suitablity for a given componet or application. If you enjoy using this library, please buy one of our products at <a href=" www.sparkfun.com">SparkFun.com</a>. Licensing: Creative Commons ShareAlike 4.0 International - https://creativecommons.org/licenses/by-sa/4.0/ You are welcome to use this library for commercial purposes. For attribution, we ask that when you begin to sell your device using our footprint, you email us with a link to the product being sold. We want bragging rights that we helped (in a very small part) to create your 8th world wonder. We would like the opportunity to feature your device on our homepage. <h3>Plated Through Hole - 4 Pin</h3> Specifications: <ul><li>Pin count:4</li> <li>Pin pitch:0.1"</li> </ul> Example device(s): <ul><li>CONN_04</li> </ul> >NAME >VALUE <h3>Plated Through Hole -8 Pin</h3> Specifications: <ul><li>Pin count:8</li> <li>Pin pitch:0.1"</li> </ul> Example device(s): <ul><li>CONN_08</li> </ul> >NAME >VALUE <h3>Plated Through Hole -12 Pin</h3> Specifications: <ul><li>Pin count:12</li> <li>Pin pitch:0.1"</li> </ul> Example device(s): <ul><li>CONN_12</li> </ul> >NAME >VALUE Plated Through Hole - 4 Pin Specifications: Pin count:4 Pin pitch:0.1" Example device(s): CONN_04 Plated Through Hole -8 Pin Specifications: Pin count:8 Pin pitch:0.1" Example device(s): CONN_08 Plated Through Hole -12 Pin Specifications: Pin count:12 Pin pitch:0.1" Example device(s): CONN_12 Generated from BeagleBone_Blue.sch by exp-lbrs.ulp >NAME >VALUE * >Value * >Name <Darlington Transistors TRANSISTOR ARRAYS <author>Created by SamacSys</author> DW (R-PDSO-G18) >NAME >VALUE Test Pins/Pads Cream on SMD OFF. new: Attribute TP_SIGNAL_NAME <author>Created by librarian@cadsoft.de</author> TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE * * >NAME >VALUE >NAME >VALUE >NAME >VALUE <Microchip RN4870-V/RM118 Bluetooth Chip 4.2 <author>Created by SamacSys</author> RN4870 >NAME >VALUE Molex Connectors <author>Created by librarian@cadsoft.de</author> KK® 254 Solid Header, Vertical, with Friction Lock, 2 Circuits, Tin (Sn) Plating<a href =http://www.molex.com/pdm_docs/sd/022232021_sd.pdf>Datasheet </a> >NAME >VALUE 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 6 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980671_sd.pdf>Datasheet </a> >NAME >VALUE 1 >NAME >VALUE Generated from BeagleBone_Black_Wireless.sch by exp-lbrs.ulp <3-V to 5.5-V multichannel RS-232 line driver and receiver with +/-15-kV IEC ESD protection <author>Created by SamacSys</author> MAX3232ECPWR >NAME >VALUE <RS-422/RS-485 Interface IC RS485/RS422 Driver/ Receiver Transceiver <author>Created by SamacSys</author> SP3077EEN-L >NAME >VALUE >Value >Name <Subminiature Tact Switch for SMT <author>Created by SamacSys</author> KSR >NAME >VALUE JLCPCB design rules (2 layers) <ul> <li>Board thickness: 1.6mm</li> <li>Copper weight: 1oz (35um)</li> <li>Note: annular ring aren't minimal</li> </ul> Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.